PL-200(RIE)Reactive ion etching machine is one of the core equipment in semiconductor technology. In the semiconductor manufacturing process, it uses plasma energy to fine process silicon wafers, which is a key step in the manufacture of microelectronic devices. Plasma etchers have a high degree of precision and can create extremely complex patterns at the microscopic level. Plasma etchers are widely used in the semiconductor industry. It can be used not only to etch semiconductor materials, such as silicon and phosphorus, but also to make chips and circuits. In addition, reactive ion etchers also play an important role in the fields of microelectronics, micro-electro-mechanical systems (MEMS) and nanotechnology application manufacturing.
Reactive ion etching (RIE) is a dry etching technology that operates on the principle of using molecular gas plasma for etching in a vacuum system. This process involves applying high-frequency voltage between flat electrodes to generate an ion layer, where the sample is placed, and ions collide with the sample at high speed to complete the chemical reaction etching. RIE technology achieves anisotropic etching through ion-induced chemical reactions, which means that ion energy creates a damaged layer on the surface of the etched layer that is easier to etch and promotes chemical reactions. At the same time, ions can also remove surface byproducts to expose a clean etching surface. This etching technology is characterized by high selectivity and high etching rates, and it is widely used in the fine processing of chip manufacturing and other fields.
Dielectric materials (SiO2, SiNx, etc.) Silicon based materials (Si, a-Si, poly Si) Sputtering metals (Au, Pt, Ti, Ta, W, etc.)
Two, three, four, eight inches
-20°℃~100℃
Integrated Circuit and Chip Manufacturing, Micro Electro Mechanical Systems (MEMS) Manufacturing, Biomedical Applications
