PL-200(RIE)Reactive ion etching machine is one of the core equipment in semiconductor technology. In the semiconductor manufacturing process, it uses plasma energy to fine process silicon wafers, which is a key step in the manufacture of microelectronic devices. Plasma etchers have a high degree of precision and can create extremely complex patterns at the microscopic level. Plasma etchers are widely used in the semiconductor industry. It can be used not only to etch semiconductor materials, such as silicon and phosphorus, but also to make chips and circuits. In addition, reactive ion etchers also play an important role in the fields of microelectronics, micro-electro-mechanical systems (MEMS) and nanotechnology application manufacturing.

PL-800(RIE)Reactive ion etching machine is one of the core equipment in semiconductor technology. In the semiconductor manufacturing process, it uses plasma energy to fine process silicon wafers, which is a key step in the manufacture of microelectronic devices. Plasma etchers have a high degree of precision and can create extremely complex patterns at the microscopic level. Plasma etchers are widely used in the semiconductor industry. It can be used not only to etch semiconductor materials, such as silicon and phosphorus, but also to make chips and circuits. In addition, reactive ion etchers also play an important role in the fields of microelectronics, micro-electro-mechanical systems (MEMS) and nanotechnology application manufacturing.

PL-200(ICP)Inductively coupled plasma etching machine has a wide range of applications in many fields, mainly including, in the field of electronics and communication technology can be used for silicon dioxide, strained silicon, silicon carbide, polysilicon gate structure, III-V compound and other semiconductor materials, as well as metal wire, metal welding pad and other metal materials. In the field of mechanical engineering, it is often used for deep groove etching of silicon materials, and shallow silicon etching in MEMS (micro-electromechanical system) surface technology. In addition, it also has potential application value in nanotechnology, biotechnology, optical technology and other fields.

PL-800(ICP)Inductively coupled plasma etching machine has a wide range of applications in many fields, mainly including, in the field of electronics and communication technology can be used for silicon dioxide, strained silicon, silicon carbide, polysilicon gate structure, III-V compound and other semiconductor materials, as well as metal wire, metal welding pad and other metal materials. In the field of mechanical engineering, it is often used for deep groove etching of silicon materials, and shallow silicon etching in MEMS (micro-electromechanical system) surface technology. In addition, it also has potential application value in nanotechnology, biotechnology, optical technology and other fields.

PL-800(ICP CVD) inductively coupled plasma chemical vapor deposition equipment has a wide range of applications in the semiconductor industry, such as the preparation of silicon nitride (SiN), silicon oxide (SiO2) and other dielectric films, these films play an important role in semiconductor devices, as an insulating layer, passivation layer or protective layer. It can also be used to prepare semiconductor materials such as amorphous silicon (a-Si) for solar cells, thin film transistors and other fields. Icp-cvd technology can be used to prepare composite materials with excellent properties, such as fibrous or whisker sediments, which can be used as the reinforcement phase of composite materials to improve the mechanical properties and thermal stability of composite materials.

PL-200(ICP CVD) inductively coupled plasma chemical vapor deposition equipment has a wide range of applications in the semiconductor industry, such as the preparation of silicon nitride (SiN), silicon oxide (SiO2) and other dielectric films, these films play an important role in semiconductor devices, as an insulating layer, passivation layer or protective layer. It can also be used to prepare semiconductor materials such as amorphous silicon (a-Si) for solar cells, thin film transistors and other fields. Icp-cvd technology can be used to prepare composite materials with excellent properties, such as fibrous or whisker sediments, which can be used as the reinforcement phase of composite materials to improve the mechanical properties and thermal stability of composite materials.

PL-800(PECVD) is a thin film deposition technology commonly used in the semiconductor industry to produce high-quality thin film layers, such as dielectric layers, low dielectric materials, etc., which are critical to improving the performance and reliability of semiconductor devices. In the production of optoelectronic devices, PECVD technology is used to deposit high-quality dielectric films and optical films to manufacture lasers, optical modulators, fiber optic sensors and other devices. PECVD is also used in the production of silicon-based optoelectronic devices, which have important applications in optical communication and integrated optics. PECVD plays an important role in the fields of semiconductor, new energy, biomedicine, electronics and materials science, etc. With the continuous progress of technology and the continuous expansion of application fields, this technology will play an important role in more fields and promote the development of related industries

PL-200(PECVD) is a thin film deposition technology commonly used in the semiconductor industry to produce high-quality thin film layers, such as dielectric layers, low dielectric materials, etc., which are critical to improving the performance and reliability of semiconductor devices. In the production of optoelectronic devices, PECVD technology is used to deposit high-quality dielectric films and optical films to manufacture lasers, optical modulators, fiber optic sensors and other devices. PECVD is also used in the production of silicon-based optoelectronic devices, which have important applications in optical communication and integrated optics. PECVD plays an important role in the fields of semiconductor, new energy, biomedicine, electronics and materials science, etc. With the continuous progress of technology and the continuous expansion of application fields, this technology will play an important role in more fields and promote the development of related industries

The IBE-100 ion beam etching machine plays a key role in various high-tech and industrial fields, such as semiconductor manufacturing, microelectronics and optoelectronics, MEMS (Micro Electro Mechanical Systems), biomedicine, nanomaterial preparation, data storage and magnetic recording, and aerospace, due to its high precision and high controllability. It uses high-energy ion beams to bombard the surface of materials, causing atomic sputtering and achieving the purpose of etching. This etching technique can produce extremely fine device structures, improve the performance and stability of chips, and also create nanoscale structures on the surfaces of various materials, such as nanowires, nanopores, etc. This is of great significance for fields such as nanoelectronics and biomedical research. In addition, ion beam etching machines can also be used for the manufacturing of optical devices, to perform micro treatments on the surface of optical devices, improve surface quality, manufacture fine structures, and thereby enhance the performance and efficiency of optical devices.

The IBE-150 ion beam etching machine plays a key role in various high-tech and industrial fields, such as semiconductor manufacturing, microelectronics and optoelectronics, MEMS (Micro Electro Mechanical Systems), biomedicine, nanomaterial preparation, data storage and magnetic recording, and aerospace, due to its high precision and high controllability. It uses high-energy ion beams to bombard the surface of materials, causing atomic sputtering and achieving the purpose of etching. This etching technique can produce extremely fine device structures, improve the performance and stability of chips, and also create nanoscale structures on the surfaces of various materials, such as nanowires, nanopores, etc. This is of great significance for fields such as nanoelectronics and biomedical research. In addition, ion beam etching machines can also be used for the manufacturing of optical devices, to perform micro treatments on the surface of optical devices, improve surface quality, manufacture fine structures, and thereby enhance the performance and efficiency of optical devices.

The IBE-75 ion beam etching machine plays a key role in various high-tech and industrial fields, such as semiconductor manufacturing, microelectronics and optoelectronics, MEMS (Micro Electro Mechanical Systems), biomedicine, nanomaterial preparation, data storage and magnetic recording, and aerospace, due to its high precision and high controllability. It uses high-energy ion beams to bombard the surface of materials, causing atomic sputtering and achieving the purpose of etching. This etching technique can produce extremely fine device structures, improve the performance and stability of chips, and also create nanoscale structures on the surfaces of various materials, such as nanowires, nanopores, etc. This is of great significance for fields such as nanoelectronics and biomedical research. In addition, ion beam etching machines can also be used for the manufacturing of optical devices, to perform micro treatments on the surface of optical devices, improve surface quality, manufacture fine structures, and thereby enhance the performance and efficiency of optical devices.

The IBSD-100 dual ion beam sputtering assisted deposition coating is developed on the basis of single ion beam sputtering technology, adding an auxiliary ion source on top of the main sputtering source. It can be used for sputtering deposition of single-layer and multi-layer thin films of various metals, alloys, III-V compounds, and semiconductor materials. It can also synthesize thin films of oxides, nitrides, carbides, etc. from elemental materials through reactions.

The COMET RF power supply system consists of key components such as impedance matching network, RF generator, and vacuum capacitor, which can accurately control the plasma treatment process of silicon crystal disk and glass substrate, ensuring the high quality and performance of the product.

Turbomolecular pump is a vacuum pump that uses a high-speed rotating impeller to transfer momentum to gas molecules, causing directional flow and pumping of gas. The main function of a turbomolecular pump is to generate and maintain high vacuum in a vacuum system. By the interaction between the high-speed rotating impeller and gas molecules, gas molecules are extracted from the vacuum system, thereby achieving the goal of reducing the internal gas pressure of the system.